Global Wafer Back Grinding Tape Market – Industry Analysis and Forecast (2019-2027)

 Global wafer back grinding tape market size was US$ XX Bn in 2019 and is expected to reach US$ XX Bn by 2027, at a CAGR of 5% during the forecast period.

 

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Global wafer back grinding tape market Definition

Wafer back grinding is one of the steps used in the semiconductor device manufacturing process to reduce thickness of the wafer and to allow high-density packaging and stacking of integrated circuits (IC). It is also called as wafer thinning process. The tape which is designed to protect surface of semiconductor wafers throughout the wafer back grinding process is known as wafer back grinding tape.
Global wafer back grinding tape market Dynamics

Growing market for semiconductor manufacturing industry across the globe and rising need to reduce thickness of the wafers for miniature electronics applications is major driving factor behind the growth of the market. A rising need for wafer fabrication process to build components for various electronics products such as optical computer components, television amplifiers, Smartphone’s and many others electronic components, increasing trend of miniaturization of electronic devices, growing investments in wafer fabrication materials and equipments, ever changing trend of semiconductor packaging technology and ongoing advancements in handheld and portable devices are expected to improve growth of the market during the forecast period.
However, high costs associated with the UV curable back grinding tapes is the major restraining factor that could hinder the growth of the market.
Global Wafer Back Grinding Tape Market: Market Overview

The progressing development and growth in semiconductor package miniaturization is creating more focus and interest in semiconductor industry. The growing significance of thinner packages is making more demand of an integrated circuit (IC) with thinner vertical structure. Also, rising need to reduce the size of the various electronics components such as semiconductor chips to use in applications such as in USB memory sticks, Smartcards, handheld music players, Smartphones and many other ultra-compact and advanced electronic products are likely to expand growth of wafer back grinding tape market during the forecast period.

By type, the global wafer back grinding tape market is segmented into UV curable and non-UV. The UV curable segment is dominated the market in 2019 and is projected to witness fast growth at a CAGR of XX% during the forecast period. A rising use of UV curable wafer back grinding tape in semiconductor device fabrication process to prevent wafer surface damages during back grinding process and to prevent contamination in wafer surface which can cause by grinding fluid and debris is accredited to the growth of the market. In addition, rising introduction of wafer back grinding tape by various market players across the globe is further expected to impel growth of the market during the forecast period. For example,

• In Apr 2017, LINTEC develops and provides a tape laminator to protect the wafer surface of the circuit during the thinning and back grinding process of the semiconductor wafer after circuit formation.
Global Wafer Back Grinding Tape Market: Regional Analysis

Region-wise, Asia Pacific held the largest market share in 2019 and is expected to maintain its dominance at a CAGR of XX% during the forecast period. The countries such as China, Japan, India and South Korea are the major key contributors behind the growth of the market. The growth is attributed to the growing market for consumer electronics and semiconductor fabrication industry across the region.

Increasing industrialization, rising adoption of consumer electronics and wearable electronics products, rising industrialization, growing manufacturing output from the region, rising government initiatives and investments in semiconductor manufacturing industry and expanding era of smart connected devices and Internet of Things (IoT) technology are driving the growth of the market in APAC region.

The objective of the report is to present a comprehensive analysis of the Global Wafer Back Grinding Tape Market including all the stakeholders of the industry. The past and current status of the industry with forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that includes market leaders, followers and new entrants. PORTER, SVOR, PESTEL analysis with the potential impact of micro-economic factors of the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers. The report also helps in understanding Global Wafer Back Grinding Tape Market dynamics, structure by analyzing the market segments and projects the Global Wafer Back Grinding Tape Market. Clear representation of competitive analysis of key players by Application, price, financial position, Product portfolio, growth strategies, and regional presence in the Global Wafer Back Grinding Tape Market make the report investor’s guide.
The Scope of Global Wafer Back Grinding Tape Market: Inquire before buying

Global Wafer Back Grinding Tape Market, By Type

• UV Curable
• Non-UV
Global Wafer Back Grinding Tape Market, By Wafer Size

• 6-Inch
• 8-Inch
• 12-Inch
• Others
Global Wafer Back Grinding Tape Market, By Region

• North America
 US
 Canada
• Europe
 UK
 France
 Germany
 Italy
 Spain
 Norway
 Russia
• Asia Pacific
 China
 India
 Japan
 South Korea
 Australia
 Malaysia
 Indonesia
• South America
 Brazil
 Mexico
 Argentina
• Middle East and Africa
Global Wafer Back Grinding Tape Market, Key Players

• AI Technology, Inc.
• AMC Co.,Ltd
• Denka Company Limited
• Force-One Applied Materials
• Furukawa Electric Co., Ltd.
• Lintec Advanced Technologies (Europe) Gmbh
• Loadpoint
• Mitsui Chemicals America, Inc.
• Nitto Denko Corporation
• Pantech Tape Co., Ltd.
• Hibex Singapore Pte Ltd
• Syagrus Systems, LLC
• Okamoto Machine Tool Works,Ltd
• Minitron Elektron GMBH
• NEPTCO, Inc
• Sumitomo Bakelite Co., Ltd
• XX
• XX

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